Other products by Electronics Manufacturing Productivity Facility (EMPF)
Item #: 400002
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Solderability of components, especially passive components, is an issue of increasing concern to the electronics industry. The primary intent of the Component Solderability Workshop was to gather electronic component vendors and users to jointly identify measures needed to improve solderability performance.

The workshop addressed both vendor and user perspectives of solderability, including regulatory issues. Participants discussed developments that may affect component and assembly solderability in hopes of arriving at an early consensus between vendors and users of measures needed to deal with these developments. Most of the measures proposed at the workshop consisted of plans for applied research and testing that may provide solutions to current as well as foreseen solderability problems.

The two-day workshop consisted of presentations and dialogue. On the morning of the workshop’s second day, the EMPF conducted a demonstration of wetting balances, interface hardware and analysis software. That afternoon participants met in small groups to identify solutions to specific issues. These proposed solutions were then discussed collectively during the final workshop session.

The following pages do not contain a chronological synopsis of the workshop presentations and discussions but rather a synopsis, by category, of identified issues and proposed measures to deal with those issues. There are two sections: the first deals with results of the general discussions and the second with the results of the task team discussions.



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