Other products by Electronics Manufacturing Productivity Facility (EMPF)
Item #: 400003
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Description 

Summary

On 23-24 March, representatives from the electronics manufacturing industry, material vendors, equipment vendors, government agencies, and the EMPF met to benchmark the status of low residue soldering technology and develop project plans for the EMPF's Low Residue (No-Clean) Soldering Program.  Through this Low Residue (No-Clean) Workshop, these subsequent proceedings, and continued coordination, EMPF will work to partner with industry and government in (1) understanding low residue soldering technology, (2) developing effective process control tools, (3) removing specification and standard barriers, (4) demonstrating acceptable processes, and (5) providing relevant training.  We hope that through such partnership, we can expedite effective implementation of no-clean processes by commercial and military electronics manufacturers.

Introduction

Safety, environment, and health converns are resulting in tightening federal, state, and local regulations and driving changes in electronics manufacturing.  In addition, decreasing military budgets and tightening profit margins are driving industry to cut costs. One of the primary new technologies which addresses both cost and safety, environment, and health concerns involves the use of a low residue (also referred to as a "no-clean") flux for attachment of components toa printed wiring board.  These low residue fluxes are designed to be left on the board, with minimal impact on long-term reliability of the product, thus minimizing the need for post-solder cleaning.  Low residue fluxes provie the possibility for assembly cleaning to be totally eliminated if incoming board and component cleanliness levels are controlled, and no significant contamination is allowed during handling and processing.  The major drawbacks of this new technology are associated with its "newness".

The goal of the EMPF's Low Residue (No-Clean) Program is to expedite implementation of no-clean processes by commercial and military sectors through research and development efforts that will help the industry by better understanding the technology; by developing, documenting, and demonstrating acceptable processes; by assisting in removal of specification and standard barriers; and by providing effective training.  To meet this goal, the EMPF undertook three major low residue soldering efforts in Fiscal Year 1993.  The following is a summary of these projects and their status.

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