Other products by Electronics Manufacturing Productivity Facility (EMPF)
Item #: 400005
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Solder paste accounts for a large percentage of the soldering defects in surface mount manufacturing. The dynamic nature of solder paste in manufacturing has the potential to cause printing and post reflow soldering defects. Currently, the industry is overpopulated with laboratory-based analysis tools to determine the quality of solder paste. Current in-process controls are, at best, made via inferences from these laboratory measurements. Laboratory measurement techniques tend to be time consuming and costly. This paper describes the need for solder paste process controls, provides a description of a solder paste process control tool, and discusses a cooperative approach to developing this tool.


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