Other products by Electronics Manufacturing Productivity Facility (EMPF)
Item #: 400006
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 In electronic assemblies, circuit density is increasing, pitch is decreasing, and package size and number of interconnects are on the rise. Virtually all aspects of manufacturing, including handling, stencil printing, reflow, etc. are affected by this move to “fine pitch” technology. Repair and rework of these assemblies is no exception. Many factors, including placement accuracy, localized cleaning, solder application, etc. are involved, and are as of yet not understood well enough to optimize processes.

The paper discusses the ability of rework stations (host gas, infrared, conductive) to provide process controlling assistance for the desoldering and soldering process and discusses the degree to which operators control the consistency of the operation. Processes for conformal coating removal, board cleaning and paste application are also discussed.

The paper also addresses the concerns of process optimization and thermal management. Modeling was done to determine the thermal profiles necessary to rework a variety of surface mounted components. The models can be used to provide valuable rework information.


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