Other products by Electronics Manufacturing Productivity Facility (EMPF)
Item #: 400007
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Description 

Surface mount technology (SMT) has existed since the late 1950s, when the flack pack was introduced. SMT offers numerous advantages over through-hole technology: production costs are lower due to automated assembly processes; components are smaller (allows greater density and smaller boards); less space (height) is required; there is less interference, greater shock resistance and faster operating speed. However, SMT has disadvantages as well. The mechanical stress due to the coefficient of thermal expansion (CTE) differences will eventually crack the joint due to the shortness or absence of leads that absorb stress. SMT components are difficult to align due to the smaller leads and pitch. The leads can be easily bent or positioned incorrectly and have problems with coplanarity. Another concern is that as SMT components get smaller and assemblies get denser, a point exists where reworking/repairing with hand tools will become too costly or difficult to control. With the inherent advantages and disadvantages of using SMT, it is understandable and desirable to develop suitable rework and repair skills. SMT rework with conductive and convective hand tools is the focus of this article. 

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