Item #: 400008
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This paper is an implementation guideline for manufacturing with lead free solders and conductive adhesives. The ability to manufacture is based on the performance of the lead free solder or adhesives in the standard surface mount processes. The products built during this study were subjected to limited reliability tests. Also addressed is manufacturing using lead free solder alloys and how manufacturing processes need to change to achieve a consistent interconnect. Current work being done at the Electronics Manufacturing Productivity Facility (EMPF) will attempt to correlate manufacturing processes to reliability and will address conductive adhesive design requirements.


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