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Sandia National Laboratories has developed a packaging technology that repatterns an integrated circuit (IC) at wafer level from a peripheral pad configuration into an area array configuration.  The repatterned die is called a mini-Ball Grid Array (mBGA).  The geometries of the repatterning allow current SMT equipment and processes to be used to assemble the repatterned die.  In addition, the mBGA die can be functionally tested prior to assembly without degradation.  mBGA technology offers a Known Good Die (KGD) for direct flip chip attach using conventional SMT assembly equipment.

This paper explains the wafer repatterning process, outlines the KGD strategy, discusses several potential applications for the mBGA and outlines the efforts of Sandia and the Electronics Manufacturing Productivity Facility (EMPF) to commercialize this technology.


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