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Item #: P140-D
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Failure Analysis Techniques for Electronics provides an overview of the characterization methods available at ACI Technologies, Inc. for determining the causes of failure in electronics devices. 
 
This publication will assist the reader in making informed decisions when troubleshooting a manufacturing problem and/or collaborating with an analytical laboratory. The proper selection of the appropriate test methods will help to identify the process conditions that lead to less than desirable issues and in turn assist in delivering a quality product.
 
The failure analysis topics included are:
  • Decapsulation/delidding
  • Dye and pry testing
  • Microsectioning
  • Qualification of bare boards and assemblies
The characterization methods included are:
  • Imaging
  • Cleanliness testing
  • Solderability testing
  • Spectroscopic analysis
  • Thermal analysis
  • Wire bond mechanical testing
  • Non-destructive testing
  • Counterfeit component screening
  • Solder analysis
  • Environmental stress screening
Case studies are provided in the areas of: 
  • Head-on-pillow
  • Solder voiding
  • Pad cratering
  • Surface finish issues
    • Porous or thin gold over nickel
    • Black pad
    • Gold embrittlement
  • Corrosion products
Full color images and data are provided, as well as real world examples of test results.
48 pages. Released January 2012.

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