Failure Analysis Techniques for Electronics (Digital Download)

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P140-D

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Failure Analysis Techniques for Electronics provides an overview of the characterization methods available at ACI Technologies, Inc. for determining the causes of failure in electronics devices.

This publication will assist the reader in making informed decisions when troubleshooting a manufacturing problem and/or collaborating with an analytical laboratory. The proper selection of the appropriate test methods will help to identify the process conditions that lead to less than desirable issues and in turn assist in delivering a quality product.

The failure analysis topics included are:

Decapsulation/delidding
Dye and pry testing
Microsectioning
Qualification of bare boards and assemblies

The characterization methods included are:

Imaging
Cleanliness testing
Solderability testing
Spectroscopic analysis
Thermal analysis
Wire bond mechanical testing
Non-destructive testing
Counterfeit component screening
Solder analysis
Environmental stress screening

Case studies are provided in the areas of:

Head-on-pillow
Solder voiding
Pad cratering
Surface finish issues
- Porous or thin gold over nickel
- Black pad
- Gold embrittlement
Corrosion products

Full color images and data are provided, as well as real world examples of test results.

48 pages. Released January 2012.