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Item #: 33003
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Participants experience an intense, hands-on printed circuit board rework and repair lab coupled with a review of all the applicable procedures outlined in the IPC 7711/7721B specification. Utilizing the industry’s latest tools, materials and technology, students will perform a variety of IPC 7711 through-hole and surface mount component rework and inspection processes. Additionally, students will demonstrate advanced proficiency in IPC 7721 repair and restoration of damaged printed circuit board assemblies. An industry recognized IPC certificate, which is valid for two years, is issued upon successful completion of the course.

Students will demonstrate a variety of rework techniques, use various tips and tools as well as soldering hand pieces using lead-free solder. Companies can select training in the following modules:


  • Module 1: General Requirements (prerequisite for all other modules)


  • Module 2: Wire Splicing
  • Module 3: Through-Hole Components Rework
  • Module 4: Chip and MELF Rework
  • Module 5: SOIC and SOT Rework
  • Module 6: J-Lead and Gull Wing Rework
  • Module 7: PWB Circuit Repair
  • Module 8: Laminate Repair
  • Module 9: Conformal Coating

Duration: Varies dependant upon the modules selected

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